SiCarrier in China Shocks Chip Industry with Broad Array of Equipment Revealed at SEMICON 2025, Challenging ASML’s Stronghold

China’s leading manufacturer of chipmaking tools, SiCarrier, has recently introduced an impressive array of equipment aimed at advancing domestic semiconductor production capabilities.

In recent times, China’s progress in the semiconductor industry has been nothing short of remarkable, driven by a strategic initiative to lessen international dependencies. Companies like Huawei and SMIC have been instrumental in this effort, paving the way for China to establish its semiconductor production infrastructure. However, SiCarrier, often linked with Huawei, has emerged as a significant player, specializing in the development of advanced chipmaking tools. During the SEMICON 2025 event in China, SiCarrier showcased its latest range of equipment, signaling their determination to push boundaries.

At the heart of this development, SiCarrier has expanded its catalog, as revealed at SEMICON and highlighted by @zephyr_z9 on Twitter. Among the new tools, SiCarrier has introduced Rapid Thermal Processing (RTP) systems, essential for the fabrication of integrated circuit devices. The catalog reveals a broad array of new tools, although it notably lacks any lithography equipment—a segment SiCarrier might be keeping under wraps. This new collection is designed to challenge industry giants like ASML and Applied Materials, although the domestic effectiveness of these tools remains to be proven.

During SEMICON, SiCarrier’s President, Du Lijun, asserted that their domestic tools possess the capability to produce 5nm chips. However, due to non-optical technology constraints, the company faces yield rate challenges, resulting in higher production costs compared to international alternatives. SiCarrier is actively collaborating with SMIC and Huawei to tackle these issues, and given the national importance of achieving semiconductor independence, a breakthrough seems promising in the near future.

SiCarrier’s primary goal is to shift the semiconductor power balance away from countries like the Netherlands, a key provider of chipmaking equipment. Previous reports have detailed how SiCarrier, in conjunction with Huawei and the Shenzhen government, is working on developing custom EUV prototypes utilizing laser-induced discharge plasma (LDP). This initiative marks the first step toward China creating its own EUV lithography equipment, a crucial development in establishing cutting-edge production capabilities for the nation.